Optical inspection machine MRD-3100 series

for LED wafersparticleindustrial

Ball AOI / Bump AOI Prodcut Presentation Particle inspection equipment MRD-3100 series for COG, FOG, and COF products, particularly for the binding defect detection of LCD display module. Leading in the industry, reaching the technical level of its counterpart made in South Korea; Satisfying the LCD modules in different sizes, including smart wearable devices, cell phones, tablets, laptops, in-vehicle devices, displays, TVs, and other products;                                                            Adopting the modular design, applicable to unilateral, multillateral COG, FOG, COF process product inspection. Covering the detection items as follows:  bump offset, particle count, bump foreign objects, FPC corrision, and Bump area crack fragments.  Ball AOI / Bump AOI Key Points 1. Detection accuracy: 3um, leading in the industry 2. Software functions: independently developed algorithms, software function customization services; 3. Auto-focus imaging system, satisfying the detection needs of products in different sizes;