Wafer dicing saw 139
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Description
0
Multiple sizes available
Mainstream 812" ceramictable(Optional) .
03
High configuration
Standard image recognition.Standard NCS (non-contact setup)
function.
02
High standards
Comply with international standards,high precision design.
04
User-friendly interface
Applicable to 8" to 12" wafers withuser-friendly and easy-to-use Ulinterface.
05
Variousoptionalfunctions
OptionalBBD(Blade Breakage
Detection)function.
Optional kerf-check
Optionalmulti-workpiece cutting,autodressing, 12 inch square table andother functions.Optional UV system.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.