Wafer dicing saw MRA139

wafer dicing saw
wafer dicing saw
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Description

High-throughput Up to 12,000 pcs/min. Easy to operate Smart and digital interface with user-friendly design. Good compatibility Available for resistance, capacitor, inductor, LED, magnetic ring, semiconductor chip detection and 0.6x0.3x0.2mm product detection for minimum size. High accuracy Defect judgment is made based on IntellVega vision platform, and more than 100 kinds of defects can be inspected, with detection accuracy <10μm. Stable and reliable High-precision servo, high-frequency solenoid valve (5billion times of service life), high-performance optical glass turntable.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.