Data transmission wireless module SLM550

dual-band

New Product Launch | MeiG Smart Launches Smart Module SLM550 to Upgrade Intelligent New Retail In recent years, with the rapid development of technology and the continuous progress of human society, great changes have taken place in our life. In terms of payment methods, the scanning payment and face recognition payment greatly improve the efficiency and consumption experience. The existing hand-held POS and face payment devices adopt different hardware platforms, which adds to the difficulties for many manufacturers to stock and develop. In order to meet the needs of the industry and balance the R&D cycle and cost, MeiG Smart launches the cost-effective smart module SLM550, which is equipped with Qualcomm Snapdragon QCM2290 platform, with 11nm advanced technology, quad-core 2.0GHz A53 architecture, and eMCP supporting minimum 2GB LPDDR4+8GB eMMC. It adopts the latest Android 11 system, and has built-in 2.4&5G dual-band Wi-Fi, BT5.0, Beidou/GPS/Glonass multiple positioning systems and nearly 0.2TOPS computing power. SLM550 can perfectly adapt to the requirements of different customers with high cost performance. Compared with the previous series of SLM755L(MSM8909) and SLM758(SDM450) modules, SLM550 module has the following advantages: 11nm process, lower power consumption; higher performance; better cost advantage. Meanwhile, without changing the package, the CPU of SLM550 series can be upgraded: QCM2290 can be replaced by QCM4250 and QCM4290, so as to realize the rapid upgrade of product capability. Based on QCM4290 platform, it can reach nearly 1TOPS computing power, which is promising in AI application field.