Hot air rework station MS9000SE

automaticsemi-automaticfor BGA

We provide ""skill-less"" rework operations for a wide variety of rework processes. Three ""skill-less"" We use the latest technology to solve the issues we have faced in the past. 1. Automated component alignment, a time-consuming and labor-intensive process. Component alignment can be completed with a single click using our proprietary image processing technology (pattern matching/visual move function). 2. Automated temperature profile creation & acquisition Our self-developed ITTSII (Automatic Temperature Tracking System) makes it possible to simultaneously acquire board temperature profiles while removing components. This system can complete profiling in about 15 minutes, which used to take half a day to a full day, leading to a significant reduction in work time. 3. Flexible ""Function Expansion"" Choice of heating method at top heater (Hot Air or IR) & easy switching. In addition to the standard hot air heating system, IR (infrared) heating unit can be installed and easily switched. Functions can be added after installation such as Residual Solder Cleaning Unit(Option), Chip Unit for 0406 or 0603 (Option) and etc. New functions can be freely added even after the system is delivered. One-touch replacement allows customization to meet your needs. So please feel free to contact us."