Inspection module SpectorBOX X1

■ 3D direct volumetric measurements of solder joints ■ Pin height measurements ■ Shape analysis of solder joints ■ Press-Fit penetration inspection ■ Effective high-gloss solder reflection suppression enhancing repeatability and reliability ■ Minimal shadow effects from tall components enhancing repeatability and reliability ■ High-clearance over 150mm (5.9″) on the THT components side ■ High-clearance over 100mm (3.9″) on the THT solder side for use under various conveyer systems ■ 60mm Z-axis for inspecting at different heights The SpectorBOX X1 delivers direct volumetric measurements of solder joints from Selective, Wave, Robotic, Pin-in-Paste Reflow, and Manual soldering systems. Drawing on Mek’s extensive experience in THT soldering measurements, this compact 3D modular AOI offers an impressive high clearance of 150mm (5.9″) and beyond on the THT components side and over 100mm (3.9″) on the THT solder side, enabling comprehensive 3D THT solder joints and component inspections. With effective shadow and high reflection suppression, along with high repeatability rates in 3D volumetric measurements, the SpectorBOX X1 redefines quality control standards, all while maintaining a highly competitive price point. Its compact design, separate control box, and I/O options make it easy to integrate into existing conveyor systems. SpectorBOX Modular THT AOI Solution ■ Designed for THT Solder Inspection of Wave, Selective, Robotic, Laser and Hand Soldered boards ■ Anomaly detection for bridges, balls and foreign material ■ Component inspection with high clearance possibilities ■ Easy Exchangeable and Serviceable module concept