Ultrasonic cutting device

Ultrasonic cutting device - Microxact
Ultrasonic cutting device - Microxact
Ultrasonic cutting device - Microxact - image - 2
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Characteristics

Specifications
ultrasonic

Description

Our Ultrasonic Cutter, though not as capable as our Laser Cutter, provides a cost-effective solution for contact trimming. The Ultrasonic Cutter is very well suited for the following applications: • Removal of passivation layers to facilitate micro-probing • LCD repair • Trimming of film resistors, MEMS parts, and gold capacitors. • Removal of materials from flex circuits and semiconductors Specifications • Oscillating Frequency 40kHz • Maximum Output 20W • Maximum Power Consumption 25VA • Power Supply AC100V 50/60Hz • Operating Temperature Range 5~45°C

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.