Injection molding simulation software Compression Molding (in IC Packaging)

Compression Molding is a process in which the molding polymer, called charge or compound, is squeezed into a preheated mold to form the shape of the mold cavity with heat and pressure until the charge has cured. The process is suitable for parts that require complex geometry, high strength and high impact resistance. Its main benefits are high-volume production and low costs. Thermoset materials with chopped fibers and particulate fillers are typically applied in compression molding, but few thermoplastic materials are also applicable.