FEA mechanical fatigue analysis software Underfill

Applicable IndustriesIC PackagingEnhancements of Underfill MoldingDue to low thermal expansion coefficient of flip chip materials, deformation often occurs in a thermal cycle. The unexpected deformation will cause mechanical fatigue and lead to solder defects or breaking problems. Therefore, Underfill Molding has been developed to increase the quality reliability of flip chip.Challenges in Underfill Simulation Calculate the surface tension force accurately Track the stability of melt advancementExplore Moldex3D’s Capabilities Visualize the surface tension behavior among encapsulant, bumps and substrate Visualize the filling pattern of the dynamic dispensing process