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Signal cable harness BiPass
I/Omulti-strandfor telecommunication networks

signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
signal cable harness
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Characteristics

Cable type
signal, I/O
Configuration
multi-strand
Applications
for telecommunication networks, backplane
Other characteristics
high-speed

Description

BiPass I/O High-Speed Solutions with low-insertion-loss copper twinax cables serve as a PCB alternative to enable efficient and reliable implementation of 56 and 112 Gbps PAM-4 protocols. What is it? The Molex BiPass solution allows designers to bypass the lossy printed circuit board through high-speed twinax cabling, providing lower insertion loss, efficient thermal management, and great signal integrity performance. Who does it benefit? The data center and telecom infrastructure industries are constantly changing and progressing. The BiPass solution can help alleviate several of the issues that manufacturers are having. From space constraints to heat dissipation to increasing speed needs, Molex can help provide a quality system to take your end products to the next level. Why Molex? Our skilled team of experts are ready to work with you to discover the best solution for you. With several different configurations and design flexibility, the BiPass solution is available in a multitude of options to serve your needs. In data centers and telecommunication infrastructure, 56 and 112 Gbps PAM-4 signaling is the latest development in serial data signal formats. Implementation of high data rate protocols such as PAM-4 require a clean channel (i.e., low signal-to-noise ratios). Compared to PCB materials, BiPass I/O Cable Assemblies dramatically reduce insertion loss between the ASIC and the front panel I/O, creating greater channel margins. As signal integrity becomes paramount, data center and network designers can no longer utilize inexpensive FR4 material. Yet, better-performing PCB materials come at a price premium.

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Exhibitions

Meet this supplier at the following exhibition(s):

SPS 2024
SPS 2024

12-14 Nov 2024 Nüernberg (Germany) Hall 10.0 - Stand 110

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.