Flexible printed circuit board

for communication module

Flexible printed circuits (FPC) enable electronics packaging. Offering unique capabilities for bending, routing, serviceability, and assembly, flexible printed circuits fit your needs. From high-speed datacom to reliability medical and automotive markets, flexible printed circuits have electronic, mechanical, and thermal properties to meet your design and reliability requirements. Molex is your FPC design partner offering a total solution from concept to production. Our design expertise in impedance control, shape forming, power carrying, and high circuit count routing means we’ll help you create the right design the first time. We then support your design with recommendations for manufacturability and offer prototyping and production where it fits best globally. Whether your design is static or dynamic, high speed or high reliability, Molex has the right solution for you. Interconnect Assemblies • Virtually unlimited variety of interconnect options • Reduces assembly time • Provides a one-piece solution to complex electronic packaging problems • Single-sided • Double-sided • Multi-layer Multi-Layer Assemblies • Three or more layers • Large number of interconnect options • High-density routing • Impedance control • Low signal loss • Multi-layer Rigid Flex Circuits and Assemblies • Elimination of connectors and cables for improved reliability • Combines PCB capability with FPC flexibility • Rigid flex Flexible Printed Circuits • Reduced form factor • 3D routing • Mechanical motion • Improved assembly • Improved reliability • Serviceability Automotive Enabling next-gen vehicle technology to meet changing connectivity needs