Flexible Hybrid Electronics are ideal for low-power and low-signal applications where space is a premium. By choosing FHE, you can design a product that bends or flexes, taking advantage of highly scalable manufacturing processes. Molex FHE leverages world-class printing, SMT component attachment, and die cutting, making FHE particularly desirable.
At Molex, we take a multidimensional approach to develop complete, integrated solutions that turn your ideas into reality. With the industry's broadest printed electronics capabilities and the expertise to develop solutions that solve your electromechanical challenges, we can advise you on the best fit for your needs, balancing performance, durability, weight, scalability and other requirements.
Molex printed electronics capabilities utilize highly scalable printing and converting processes, including laser-cutting, die-cutting and lamination. With traces as narrow as 0.127mm (0.005"), Molex can help you achieve the circuit density and form factor you need for your application.
Coupled with our printed electronics capabilities, Molex engineers developed a world-class method to solder components to silver inks on polyester substrates, allowing electronics to flex and bend to fit into tight spaces. We have streamlined our process to boost reliability, even in the most challenging conditions. These combined printing and SMT capabilities enable best-in-class FHE solutions for our customers.
Consumer and smart home appliances, wearables, VR/AR, and handheld devices - where size, flexibility and cost matter. Flexible circuits can wrap around a wrist or a torso, powering many fitness wearables.