5G mmWave RF Flex-to-Board Connectors offer excellent signal integrity (SI) performance for high-speed, extreme RF applications, along with the robust mating features and PCB real-estate space savings needed in compact 5G mobile and other communication devices.
Phone makers, RF module developers, and chipset makers can leverage industry-leading 5G mmWave connectivity technologies from Molex. The 5G25 series delivers industry-leading SI performance and adding a center shield-in contact within the receptacle or plug isolates each row to boost the overall SI stability even more to meet the toughest 5G connectivity requirements.
The compact size of the 5G25 series offers elevated printed wiring board (PWB) design flexibility. Moreover, the 5G25 enables designers of RF antenna modules and mobile devices to combine RF and non-RF signals, which reduces the need for additional connectors while producing additional space and cost savings.
5G25: Designed for fast, reliable assembly
While the 5G25 series facilitates fast, trouble-free assembly with excellent “click feeling” to prevent mismating, this ultra-compact connector features robust peel force to increase reliability and minimize the load on assembly operators or automatic assembly machines.
5G15 Series supports up to 15 GHz for high-speed applications in mobile and other extreme RF devices
With a compactness that maximizes PCB space savings, the Molex 5G mmWave RF Flex-to-Board Connector also includes other leading-edge features, such as EMI shielding and robust mating. Additionally, the ability to assign pins to both power and high-speed signals delivers much-needed design flexibility.