With the growing demand for smaller and more reliable devices, Molex’s SlimStack Board-to-Board and Board-to-FPC connectors provide robust, high-speed data transmission with various design configurations to provide design flexibility, making this an ideal solution for a wide range of solutions throughout various industries.
The rising demand for smaller, ultracompact devices is driving industries’ needs for miniaturized, reliable and robust connectors with various design options. Many designs require a complex combination of high-current power and high-operating temperatures and electrical reliability and design flexibility. Molex SlimStack Microminiature Board-to-Board and Board-to-FPC Connectors provide a wide range of design options to ensure a reliable connection. These micro/fine-pitch plugs and receptacles feature voltage ratings of up to 125V, operating temperatures up to 125℃, current ratings up to 5.0A for signal connectors, and 15.0A for battery connectors. Additionally, SlimStack SSB and SSB RP Stacking Connector series provide various stack heights.
Customers need an easy mating option that prevents the housing from getting damaged during blind mating and high-power delivery. The nail structure offers wide alignment and robustness. The metal-power-armor nail provides housing protection of up to 3.0A power, electrical reliability and a clean contact point that supports nail structure requirements for various applications. The cover nail prevents housing from being damaged during blind mating up to 50N of force, 0.80mm displacement and 5.0A power.