Air diffuser

How to maximize through-put without compromising yield. A simple means to increase the through-put of a tool without affecting yield is to increase the speed of any steps not related to the actual formation of the semiconductor circuit. One such step is re-pressurization or "venting" of the load lock chamber, which creates a positive-pressure environment that inhibits particle migration from the clean room into the chamber. The challenge: Pressurize without disturbing particles. The chamber is a contaminated environment, and pressurization can disturb the particles contained within, causing them to fall on the wafer's surface. The challenge is to pressurize as quickly as possible, but without creating jets of gas that can disturb particles. The solution: Mott GasShield® POU (Point-of-Use) Diffusers. Mott porous metal can greatly reduce "vent" time of the load lock without the adverse "jet" effect seen through showerheads and simple 1/4" inlet lines. The porous metal reduces the velocity of the purge gas to ensure a uniform and laminar flow of gas into the chamber. Alternatives to the Mott diffuser create flows with one or more, possibly non-laminar, jets of gas. Our diffusers, by comparison, have been tested for uniform flow velocity to ±5% across the entire surface.