Bottom side selective soldering machine MPS700 mta®

automatedfor PCB

MPS700 BOTTOM-SIDE SOLDERING ROBOT Our bottom-side soldering robot gives manufacturers the ability to solder problematic joints as part of their inline process – joints that normally need to be hand-soldered offline. The MPS700 is the perfect complement or alternative to wave, mini-wave, and traditional selective soldering techniques. Examples of problematic joints the MPS700 can solder: High mass joints can be damaged by the selective mini-wave. The MPS700’s soldering head uses a powerful heating iron to preheat and reflow solid solder wire - it does not use molten solder to pre-heat the solder joint. This means there is no risk of solder dissolution. Joints close to larger components, low-temp components, or plastic assemblies are difficult to access using other technologies. The angled approach of the solder iron and wire feeder allow the head to access many difficult-to-reach joints. Flux is generally a problem for boards assembled to other boards or in housings. The MPS700 uses flux-core solder wire to neatly solder each joint, so there is no messy pre-flux to clean. Other advantages of the MPS700: - Much lower energy cost – no solder pots to continuously heat - Lower risk of dendrite formation - Quickly and easily change the solder alloy – simply swap the solder spool - Very low maintenance – no solder tanks, dross, or flux residue to clean - No need to wait for solder pots to heat - No bridging or stringing associated with wave soldering - Optical realignment automatically locates solder joints - Multiple process parameters can be finely tuned at each joint to account for individual requirements - Lower consumable cost; no fluxing and nitrogen required