Wafer metrology system Proforma 300i

for semiconductors

Cost-effective alternative to full-automated wafer measurement and inspection systems Product can provide measurement of thickness and bow of all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and sapphire or tape Features Front USB port enables easy storage of measurements and other data to flash drives MTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability Non-contact measurements 76-300 mm diameter wafer range Optional wafer measurement rings Wafer stops for exact centering Ethernet interface Full remote control software (Windows compatible) Optional calibration wafers About the Manual Semiconductor Metrology System The Proforma 300i wafer thickness gauge is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability. *Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance.