3D inspection machine Proforma 300SA series

surfacefor wafersfor semiconductors

Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness Measures Thickness, TTV, Bow, Warp, Site and Global Flatness. Features Exclusive MTI capacitance sensors for outstanding accuracy and repeatability Full 1000 µm thickness measurement range without re-calibration Measures Thickness, TTV, Bow, Warp and site and Global Flatness Windows® user interface ASTM Standard measurements SEMI S2-0200 health and safety compliant design SEMI S8-0999 ergonomic compliant design Measures all materials including Si, GaAs, Ge, InP, SiC *** *** provided bulk resistivity is less than 20K Ohm/cm About the Semi-automated Metrology System The Proforma 300iSA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300iSA delivers full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images. Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program. Wafer Specifications Diameter: 150 mm, 200 mm, 300 mm Material: All semiconducting and semi-insulating wafers including Si, GaAs, Ge, SiC, InP Surfaces: As-Cut, Lapped, Etched, Polished, Patterned Flat/Notch: All SEMI Standard Flat(s) or Notch Conductivity: P or N Type