Wafer metrology system PV-1000 series

Wafer metrology system - PV-1000 series - MTI Instruments
Wafer metrology system - PV-1000 series - MTI Instruments
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Characteristics

Type
for wafers

Description

For in-process monitoring of solar/photovoltaic wafers Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials. Features Up to three thickness channels per rack Proprietary MTII push/pull capacitance probes work with all wafer types Minimum, maximum, average and total thickness variation measurements Bow measurement (3 probe pairs required) Integrated data aquisition and control electronics Fast Ethernet communications ports for production rates up to 5 wafers per second Scalable for increased number of thickness line scans Digital I/O for interface with existing wafer handling equipment Windows® based control program for local or remote data monitoring Windows® based DLL package for integration with existing control PC’s Standard and custom probe sizes available About the Photovoltaic/Solar Metrology System Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.

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