For in-process monitoring of solar/photovoltaic wafers
Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
Features
Up to three thickness channels per rack
Proprietary MTII push/pull capacitance probes work with all wafer types
Minimum, maximum, average and total thickness variation measurements
Bow measurement (3 probe pairs required)
Integrated data aquisition and control electronics
Fast Ethernet communications ports for production rates up to 5 wafers per second
Scalable for increased number of thickness line scans
Digital I/O for interface with existing wafer handling equipment
Windows® based control program for local or remote data monitoring
Windows® based DLL package for integration with existing control PC’s
Standard and custom probe sizes available
About the Photovoltaic/Solar Metrology System
Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.