MSXP-C is a resin spring coupling with single-piece construction.
A slit is inserted into a cylindrical material. A plate spring formed by a slit allows eccentricity, angular misalignment, and end-play to be accepted.
It can be used in an environment or cleanroom where heat resistance and chemical resistance are required, such as FPD / Semiconductor manufacturing equipment.
Engineering plastic PEEK superior in physical and chemical properties is adopted.
Outgas quantity is extremely low. Electrically insulated.
Cleanroom wash/cleanroom packing provided as standard.
Application
FPD manufacturing device / Semiconductor manufacturing device / Ultra-high vacuum (UHV)
Please feel free to contact us for a quotation.