3D laser processing machine

Get the CapStone Advantage! New-generation laser technology and control capabilities to deliver breakthrough productivity. Increase throughput up to 2X! Reduce overall processing costs by up to 30%. As a part of ESI’s market-leading family of flex PCB processing systems, CapStone™ leverages ESI’s new laser technology, fluence control and beam positioning. This combination delivers the fastest blind via processing times in the industry and enables FPC processors to process a wider range of materials at high yields and high productivity with minimum process development and maximum uptime. CapStone significantly reduces cost of ownership for the full spectrum of applications and pattern densities considered by leading flex circuit manufacturers. Cut processing time by up to and beyond 2x Minimize heat-affected zones Increase yields Lower per-panel processing costs The CapStone Advantage DynaClean™ CapStone’s blind via processing speeds are significantly higher due to the incorporation of ESI’s new DynaClean™ feature using ESI’s patented esiLens™ technology. In a single pass, DynaClean™ processes both copper opening and dielectric cleaning steps that previously required multiple passes. This eliminates unproductive feature-to-feature movement time and enables significantly faster throughput than the 5335 and other UV laser systems, while delivering the same quality of via formation. AcceleDrill™ Building on the 5335’s Third Dynamics™, ESI’s latest evolution of beam positioning technology minimizes heat effects with up to and beyond 10m/s via drilling process velocities.