Modular PC MVS 2620-IPK
vehicle-mountquad-coreIntel® Atom x7-E3950

modular PC
modular PC
modular PC
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Characteristics

Configuration
vehicle-mount
Processor
quad-core, Intel® Atom x7-E3950
Ports
SATA, Mini PCIe, CAN bus, SIM card, RS-232, USB 2.0, gigabit Ethernet, RS-485, 3G, GPS, DDR3L SODIMM
Operating system
Linux, Windows 10
Domain
for harsh environments, for heavy-duty applications, data acquisition, for the transportation industry
Protection level
IP65, rugged, MIL-STD-810G
Other characteristics
fanless, modular

Description

MVS 2620-IP, an IP65-rated rugged enclosure, maintenance-free box computer, is ideal for data acquisition in extreme environments throughout a number of in-vehicle applications, like transportation, heavy duty and waste management, etc. All external interfaces, including Gigabit Ethernet, isolated CAN bus and digit I/O, USB, and RS232/485 serial ports, are implemented on IP67-proof connectors for reliable data transmission in harsh and rugged environments. MVS 2620-IP is a modular design, it is flexible to use other kinds of expansion boards to extend different I/O functions for quickly tailored to a vast number of applications. Inside the system, there’re four mini-PCIe slots with three SIM card slots offering WLAN, 3G/LTE, CAN OBD (SAE J1708/J1939) or CVBS functionality. Besides, it can operate at temperatures from -30°C to +70°C under fanless. MVS 2620-IP supports 9~36VDC power input with ignition managemnt and 12VDC at 2A maximun power output. It is compliant to E-mark and ISO 7637-2 in vehicle certificate and meet US military MIL-STD-810G, category 4, composite wheeled vehicle, for vibration and shock criteria. NEXCOM is a Titanium member of the Intel® Partner Alliance, as a top tier of the Alliance. Intel and more than 500 global IoT partners of the Intel® Partner Alliance provide scalable, interoperable Intel® -based technologies and solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first in-market solutions.

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