Modular computer MVS 5600-BU
embeddeddual-coreIntel® Core™ i7-6600U

modular computer
modular computer
modular computer
modular computer
modular computer
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Characteristics

Configuration
embedded
Processor
dual-core, Intel® Core™ i7-6600U, Intel® Core™ i3-6100U
Ports
RJ45, HDMI, VGA, DDR3L SODIMM, RS-232, CAN bus, USB 3.0, RS-485, GPS, RS-422, SATA, Mini PCIe
Operating system
Linux, Windows 10, Windows 7, Windows 8
Size
compact
Domain
monitoring, video surveillance
Protection level
rugged, MIL-STD-810G
Other characteristics
fanless, wireless, modular

Description

MVS 5600, based on 6th generation Intel® Core™ dual core i7-6600U 2.6GHz and i3-6100U 2.3GHz, is specifically designed for the harsh in-vehicle environment. It allows MVS 5600 to comply with stringent MIL-STD-810G military standard in rugged, fanless and compact mechanism. MVS 5600 is a modular design, it is flexible to use other kinds of expansion boards to extend different I/O functions for different applications. MVS 5600 leverages wireless networks to simplify fleet management with capabilities such as remote, real-time video monitoring. This remote capability keeps transit fleets in service around the clock. Vehicle data integration and diagnostics are also carried out via CAN Bus and OBDII. With iButton function, it is easy to perform driver identification management. Optional internal back-up battery guards against any unexpected vehicle power failure or unstable vehicle power. Main Feature ‧ Modular design for flexible I/O expansion ‧ Three SIM cards + dual WWAN modules support ‧ Wake on RTC/SMS via WWAN module ‧ Built-in u-blox NEO-M8N module, optional Dead Reckoning support ‧ Intel® Core™ dual core i7-6600U/i3-6100U ‧ Voice communication via WWAN module NEXCOM is a Titanium member of the Intel® Partner Alliance, as a top tier of the Alliance. Intel and more than 500 global IoT partners of the Intel® Partner Alliance provide scalable, interoperable Intel® -based technologies and solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first in-market solutions.

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