Embedded computer VTC 1010
vehicle-mountIntel® Dual Core™ ATOM E3827USB 3.0

embedded computer
embedded computer
embedded computer
embedded computer
embedded computer
embedded computer
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Characteristics

Configuration
embedded, vehicle-mount
Processor
Intel® Dual Core™ ATOM E3827
Ports
USB 3.0, DDR3L SODIMM, RS-232, USB 2.0, RS-485, RJ45, CAN bus, GPS, RS-422, SIM card, SATA, Mini PCIe
Operating system
Windows 7, Windows 8
Size
compact
Domain
for digital signage
Protection level
rugged, MIL-STD-810G
Other characteristics
fanless, wireless, multimedia

Description

VTC 1010 features next generation Intel® Atom™ processor E3827, 1.75GHz, with powerful graphic and multimedia enhancement. VTC 1010 is packed rugged, fanless, and 1 DIN compact enclosure. It is specifically designed to comply with stringent MIL-STD-810G military standard. VTC 1010 comes with build-in CAN BUS 2.0B interface and optional OBDII (SAE J1939) port to monitor the vehicle operating status real-time and troubleshoot a non-working vehicle. With dual SIM cards design, it allows the choice of the best service carrier network and minimizes roaming cost. VTC 1010 can be configured to work with two independent WWAN connections and can effectively increase the bandwidth for faster massive data transfer over the air. VTC 1010 also supports two-way voice communication. Equipped with intelligent vehicle power management, VTC 1010 can be waked up by ignition, RTC timer, or remote dial-up for flexible operation or maintenance. VTC 1010 can satisfy different demands for versatile telematics applications, such as infotainment, fleet management, dispatching system and mobile video surveillance. Main Feature ‧ Intel® Atom™ processor E3827, 1.75GHz ‧ Dual SIM cards + dual WWAN modules support NEXCOM is a Titanium member of the Intel® Partner Alliance, as a top tier of the Alliance. Intel and more than 500 global IoT partners of the Intel® Partner Alliance provide scalable, interoperable Intel® -based technologies and solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first in-market solutions.

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