Fanless computer VTC 7260-7/-5
embeddedvehicle-mountIntel Core i5-1145GRE

fanless computer
fanless computer
fanless computer
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Characteristics

Configuration
embedded, vehicle-mount
Processor
Intel Core i5-1145GRE, Intel Core i7-1185GRE
Ports
USB 2.0, HDMI, VGA, 5G, SATA, DisplayPort, DDR4 SO-DIMM, USB 3.2, RS-232, gigabit Ethernet, RS-422, WiFi, CAN bus, RS-485, RJ45
Operating system
Linux® Ubuntu™, Windows 10, Windows 10 IoT Enterprise, Windows 11 IoT Enterprise
Size
compact
Domain
industrial
Protection level
rugged
Other characteristics
fanless, SSD

Description

VTC 7260-x is an in-vehicle AI-aided telematics computer designed with Intel 11th Gen. Tiger Lake UP3, which performs 25% more computing power than the former generation. Moreover, its 10-year product life-cycle policy can satisfy the long-term support suitable for any in-vehicle applications. With the compact, rugged, and fanless design, VTC 7260-x can widely be installed in any limited cabinet space with ease, and reduce the maintenance efforts while operating 24/7 services. In addition, the VTC 7260-x features diverse peripherals, such as 2.5GbE, USB 3.2, isolation CANBus, serial ports, ultra-speed NVMe storage, triple displays, audio in/out, DI/DO, and 9~36VDC with IGN control, making it a sophisticated in-vehicle computer. In consideration of the harsh environment applications, VTC 7260-x can be operated at the temperature range of -30°C~65°C (15W TDP) and is compliant with MIL-STD-810G military standard for anti-vibration/shock. For the regulation, VTC 7260-x is compliant with CE/FCC Class A, UKCA, and EMARK (E13). Main Feature ‧ Intel® 11th Gen Tiger Lake UP3, cost-efficient performance ‧ Compact, rugged and fanless design ‧ Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485 NEXCOM is a Titanium member of the Intel® Partner Alliance, as a top tier of the Alliance. Intel and more than 500 global IoT partners of the Intel® Partner Alliance provide scalable, interoperable Intel® -based technologies and solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first in-market solutions.

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