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Data connector QSFP-DD
QSFP-DDQSFPPCB

data connector
data connector
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Characteristics

Type
data
Format
QSFP-DD, QSFP, PCB, SMT
Electrical characteristics
insulation
Material
plastic, thermoplastic, copper
Product applications
housing, cable, data center, tape
Primary current

Max.: 1 A

Min.: 0.5 A

Operating temperature

Max.: 70 °C
(158 °F)

Min.: 0 °C
(32 °F)

Description

• Doubles the density over qsfp with eight differential pairs capable of 50 GBPS each to achieve 400GBE. • Support next generation high density data center/cloud computing data transfer solutions • Housing: High temp thermoplastic, UL94 V-0,black. • Contact Resistance: AR10 milliohms Max. for signal contacts. • Transceiver Insertion Force: 90N Max. • Durability: 50 Cycles Min. • QSFP-DD cable assemblies are similar to OSFP28 4 channel (8 pair), but use double the channels to 8 (16 pair) by using a 2nd row of contact/pad locations on the front of the PCB. • Connector is traditional SMT with 4 rows • Contacts: Copper alloywith Au plated. • Insulation Resistance: 1000 MS Min. • Transceiver Extraction Force: 50N Max. Black, 15u'' Gold(Au), SMT, High Temperature Plastic, Tape & Reel+ Black, 30u'' Gold(Au), SMT, High Temperature Plastic, Tape & Reel+

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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