X-ray inspection machine XT V 130

for semiconductorsPCBfor the electronics industry

Nikon’s XT V range comprises world-class X-ray and CT systems for non-destructive inspection of electronic components (PCBs, BGAs, chips and much more). With sub-micron feature recognition, the XT V system range meets today’s need for high performance, non-destructive inspection of complex electronic components. Nikon’s Xi Nanotech X-ray source paired with industry leading flat panel detectors produces best-in-class image quality, with seamless transition between 2D and 3D inspection. Superior X-Ray Source Nikon’s market-leading Xi Nanotech X-ray microfocus source is unique due to its exclusive integral generator design and unparalleled 160kV maximum energy and 20W true-target power. Powerful image enhancement High.Contrast Filter reveals hidden details in the radiography image by providing outstanding image quality of both high and low contrast areas in a single clear image. Operators can now identify all aspects of the sample more quickly than ever before, optimizing and increasing their productivity PCB Analysis Suite PCB Analysis Suite is capable of advanced measurement and analysis of BGA, bond wires, PTH and complex packages such as PoP on multi-layered boards, with automated pass/fail inspection and reporting. Oblique Angle Concentric Imaging Extreme oblique angle field of view up to 90°, with 360° sample rotation, maintains the region of interest thanks to intelligent software and hardware.