Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials.
Conventional, silicone-based thermal compound and greases tend to spread after a number of heating and cooling cycles (so called pump-out), creating voids, and losing effectiveness, leading to overheating of electronic components and premature product failure.
Our synthetic-based, silicone-free thermal interface materials resist degradation caused by thermal cycling, which makes them suitable for use in a wide range of electronic and electromechanical applications. Depending on application requirements, users can choose from a wide array of formulas, each with unique features and benefits.