Karbon 430 packs the power and advanced IoT capabilities of the latest Intel® Atom® x6000E processors (formerly Elkhart Lake) into a low profile, highly customizable, rugged fanless system built for the challenges of the IoT Edge.
Intel Elkhart Lake Atom x6211E or x6425E processing
4x USB, CAN bus, 2x 1GbE LAN with optional PoE
5 internal expansion slots
Hardware Line: Rugged
Cooling Type: Fanless
Processor: Intel Atom x6211E, Intel Atom x6425E
Processor Speed: 1.80 GHz to 3.0 GHz
Processor Socket: Onboard (BGA)
Processor Generation: Elkhart Lake
Processor Cores: 2, 4
Chipset: Shared with CPU
Graphics/GPU: Intel UHD Graphics
Memory Type: DDR4 SO-DIMM (non-ECC)
Memory Capacity: 32 GB
Memory Speed: 3200 MHz
Memory Slot Count: 2.000000
Number of Displays Supported: 1
Rear I/O: 1x DisplayPort, 2x 1GbE LAN ports (PoE+ optional), 1x CAN bus, 1x 3FF Micro-SIM, 1x 9 ~ 48 V Terminal Block power connector
Front I/O: 2x USB 3.2 Gen 2 ports, 2x USB 2.0 ports, 1x IO expansion slot, 1x 3FF Micro-SIM, 2x Antenna ports, 1x Power button
Expansion Options: 1x Full-size mPCIe (PCIe x1; USB 2.0), 1x M.2 3042/3052/2260/2280 B-key (PCIe x1; USB 3.0; USB 2.0), 1x M.2 2242/60/80 B-key (PCIe x1; USB 3.0; USB 2.0)
Storage Options: 1x mSATA (shared with mPCIe), 1x M.2 3042/2260/2280 B-key (PCIe x2; USB 2.0; SATA)
LAN Controller: Intel I210-IT GbE
System Monitoring: PTT in BIOS, TPM
Input Voltage: 9~48 VDC
Power Input: 3-pin Terminal Block
Operating Temperature Range: -40 ~ 70°C
Operating Humidity: 10% - 95% (non-condensing)
Dimensions (WxHxD): 180 x 123 x 60 mm / 7.09 x 4.84 x 2.36 in
Case Type: Compact, Ruggedized
Port Punchouts: 6 Antenna Holes