EDGE computer Helix 500

boxembeddedwall-mounted

Helix 500 packs Intel® 10th Gen Comet Lake Core processing into a fanless, solid state platform engineered for the challenges of edge computing environments Intel® 10th Gen Comet Lake Core i3/i5/i7/i9 processing Dual Gb LAN, 12~24V power Dual SSD and triple display capable Hardware Line: Industrial (Fanless) Cooling Type: Fanless Processor: Intel Comet Lake Core i3/i5/i7/i9 Processor Speed: Up to 3.20 GHz (G5900T), Up to 3.00 GHz (i3-10300T), Up to 2.30 GHz (i5-10500), Up to 2.0 GHz (i7-10700T), Up to 1.90 GHz (i9-10900T) Processor Socket: LGA1200 Processor Generation: Comet Lake Processor Cores: Up to 10 (processor dependent) Chipset: Intel Q470 Memory Type: DDR4 SO-DIMM (non-ECC) Memory Capacity: 64 GB Memory Speed: 2933 MHz Memory Slot Count: 2.000000 Number of Displays Supported: 3 Rear I/O: 2 USB 3.2 Gen 2 ports, 2 USB 3.2 Gen 1 ports, 2 Gb LAN ports, 3 DisplayPorts, 1 12 ~ 24 V, 4-pin DC jack (Terminal block input optional) Front I/O: 4 USB 3.2 Gen 2 ports, 1 Power Button, 1 SIM Card slot, 1 8-bit DIO port (optional), 1 COM port (optional), 1 Audio jack; line-out, mic-in *currently not functioning* Expansion Options: 1x M.2 2280/60/3042 B-key (PCIe x2; USB 3.0; SATA), 1x M.2 2230 E-key (PCIe; USB 2.0; CNVi), 1x Full-size mPCIe (PCIe x1; USB 2.0), 1x M.2 2280 M-key (PCIe x4; SATA) Storage Options: 1x M.2 2280 M-Key (PCIe x4; SATA), 1x M.2 2280/60/3042 B-key (PCIe x2; USB 3.0; SATA) Input Voltage: 12~24 VDC * Power Input: 4-pin Mini-DIN, 4-pin Terminal Block (Optional) Operating Temperature Range: 0 ~ 50°C Dimensions (WxHxD): 154 x 50.8 x 210 mm (6.06 x 2 x 8.27") Case Type: Fanless Case Material: Aluminum Port Punchouts: 6 Antenna Holes