Macro defect inspection machine F30™

surfacefor wafersindustrial

Designed to blur the lines between dark field micro inspection and traditional macro inspection, the F30 System provides automated defect inspection for front-end and outgoing quality (OQA) applications. Product Overview The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations. Applications • After develop inspection (ADI) • Fab Outgoing QA • Post CMP inspection • After etch inspection Specifications • Throughput up to 120 wph (10µm) • Resolution flexibility (10µm to 0.5µm) • Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer • Teams with edge and backside modules for all-surface solution