Wafer inspection machine Firefly®

industrialfor the packaging industrymulti-function

The Firefly inspection series provides an automated inspection solution for high performance applications like FPGA, CPU/GPU and networking servers in addition to applications with low I/O counts: IC drivers, RF transceivers, wireless connectivity and MEMS. Product Overview The platform, configurable for either wafer (round) or panel (rectangular) substrates, offers multiple imaging modes, including Onto Innovation’s patented Clearfind® Technology, a technique for enabling a large process window to detect residue defects on metal and metal defects on organic layers. The combination of substrate flexibility, defect sensitivity and metrology in a single platform reduces capital investment requirements and provides a reliable pathway to transition from wafer to panel-based processes for applications requiring high I/O counts and multiple-chip integration, such as SoC with memory, wireless module and wide I/O memory. Integration with Onto Innovation’s Discover Defect software quickly turns defect data into actionable process control, improves classification and reduces manual review. It enables our customers to develop, learn and analyze new processes reliably while significantly improving their product delivery time to market. Applications Fan-out Wafer Level Packaging (FOWLP) / Fan-out Panel Level Packaging (FOPLP) 2.5D/Interposers Embedded Die/Embedded Interposer 3DIC MEMS Image Sensors (CIS) Front-end Macro for Advanced IC nodes