Wafer metrology system Atlas® III+

Wafer metrology system - Atlas® III+ - Onto Innovation Inc.
Wafer metrology system - Atlas® III+ - Onto Innovation Inc.
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Characteristics

Type
for wafers

Description

La série Atlas à couches minces et OCD est l'outil de métrologie pour la fabrication de dispositifs FinFET, gate-all-around (GAA) FET, 3D NAND et DRAM avancés. By extending metrology performance to sub-angstrom precision and accuracy levels, the Atlas III+ system enables advanced process control across a broad range of applications in high volume manufacturing. The Atlas family of products incorporate a proprietary spectroscopic reflectometry and spectroscopic ellipsometry solution, and when combined with Onto Innovation’s industry leading Spectraprobe™ and AI-Diffract™ OCD analysis software, enable process control of every critical manufacturing unit operation. The Atlas III+ system and AI-Diffract solution provides insight of complex structure profiles across etch, clean, deposition and CMP steps.

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