Stationary thickness measuring machine Element™

filmdigital displayautomatic calibration

The only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring. Product Overview The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring. We collaborated with wafer suppliers to further improve critical wafer characteristics like epi layer thickness, epilayer resistivity and bulk resistivity using Onto Innovation’s reflection based technique. The Element system's transmission is a classic, direct method providing best sensitivity for monitoring dielectrics like BPSG, FSG, H in SiN, etc. Machine learning is used to eliminate use of monitor wafers for dielectric measurement. Reflection only based systems do not have sensitivity to most of these dielectrics. Applications • Epi layer thickness • Transition zone thickness • Epi and substrate resistivity • Power device • Bulk resistivity • Edge exclusion • Interstitial oxygen and substitutional carbon • BPSG – Boron and phosphorus content of BPSG layers • FSG – Fluorine content of FSG • SiN – Measures hydrogen in silicon nitride films • HSQ – Hydroxyl and hydrogen content in oxides SOG, FOX • SiON – Oxygen, nitrogen and hydrogen in SiON • SiCN – Carbon in SiCN • SiOC – Carbon in SiOC • Oxygendose – Measurement of Oxygen implant dose at SIMOX process • Oxygen Precipitate – Measurement of Oxygen precipitates in Si substrates