Surface inspection machine EB40™

for wafersindustrialdefect

Combining edge and backside inspection into one module Product Overview The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior. The EB40 module captures defect images on the fly, creates whole-wafer composite images, and is fully integrated for SEM bevel review. All inspection and metrology results, including defect, whole wafer and SEM images can be analyzed together in a single database using our Discover Defect software analysis package. Correlating EBR metrology with all-surface defectivity data, SEM data and micro-inspection results is only the beginning of what Discover software can do. In addition to the advanced on-tool defect binning, real-time edge ADC classification can be assigned to defects prior to manual offline review using Discover Review software. Applications Edge Inspection • Lithography process monitoring • Cracks/Chips • Residue • EBR Concentricity • Bonding adhesive inspection Backside Inspection • Scratches • Chuck/end effector signatures • Wafer level pattern detection • Backside defect to frontside defect correlation Specifications • Detects blister defects • Detects slurry, cleaning contaminants and residual films • Automated Edge Bead Removal metrology (EBR) • Detects chips and cracks • Addresses contamination issues • Finds delamination defects