Laser soldering machine SB² – SM

reflowfully-automaticfor printed circuits

Being a lower cost version of the SB²-Jet without compromising its placement accuracy, the SB²-SM is a sequential solder ball attach and laser reflow system that can operate either in a fully automatic or in a semiautomatic mode. With larger work area than the SB²-M, yet relatively compact foot print than the SB²-Jet, it is ideal for research & development, prototyping and small volume manufacturing. • Jet mode/Standard mode • Available solder ball diameter: 60 – 760μm • Suitable for chip/wafer/substrate soldering • Optional ball rework (de-balling & re-balling) capability Options • Solder Ball Rework Station • Pattern Recognition and Fiducial Alignment • Upgrade to 8” working area • Heated chuck/work stage • Specific heated work holder for BGA-like devices • Automatic Z-height measurement Benefits • High flexibility • Small solder ball handleability • Rework function