Automated Die Sorting
AutoPlace MP300: Automatic Die Handling, Ejectoring & Sorting System
Fully automated pick and place
Designed for automatic die sorting from wafer maps, including multi-project wafers (a.k.a. "pizza wafers")
User-friendly DieSort Manager software and expanded wafer map library
Quick change to new die size and output medium with pre-leveled output fixtures
Flexible platform supporting 3 inch to 300mm wafers on variety of hoops and frames types
Programmable heights and speeds
Programmable NSC edge grippers or vacuum pick-up