Soldering oven SST 5100

The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering. QuikCool™ Option for SST 5100 Adding the QuikCool™ to the SST Model 5100 reduces cycle time and increases throughput of the package assembly process. QuikCool™ is a patent pending auxiliary cooling unit designed to rapidly reduce temperature in an SST 5100 Vacuum Chamber. Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Selected 5100 Options Oil-sealed or dry vacuum pump Multiple temperature zone measurement Moisture and oxygen analyzers Illuminated chamber viewport Additional process gas input Rapid cooling system Various heated target plate materials Custom component fixtures Cooling water recirculator Castors Light tree