Automatic wire bonder 8000i

The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its patented Dual Z-Axis bond head enables very reliable Deep Access wire bond performance. This machine is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high-reliability devices. Intelligent Interactive Graphical Interface® (i2Gi®) offers the required management for modern wire bonding, from part design and development to process validation and intuitive operations control. i2Gi is implemented on the 8000i Wire Bonder and available as a Bonder Performance Upgrade (BPU) for 8000 Wire Bonders. The planarBump™ feature, a patented technology that uses gold wire to produce tailless ball bumps, makes the 8000i Wire Bonder suitable for flip chip and other advanced packaging applications. The overall precision of the 8000i Wire Bonder, along with its large work area and its available deep access capability, results in high-yield processing of fine pitch/high wire count applications. A ball bumper and stud bumper configuration of the 8000i Wire Bonder is a unique feature of this system. The 8000i Wire Bonder is the only available system that can produce co-planarized gold bumps in one step.