Flip-chip die bonder MD-P200

epoxyfor micro assemblyhigh-accuracy

Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput. The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available. • Real time US monitoring function realizes stable quality by monitoring process parameters during production • Wafer mapping software capability • Low bond force option • Epoxy writing or pin transfer • Various advanced software functions (option) will fulfill various requirement, depending on purposes Productivity * - 0.56 s / IC（Under the fastest conditions） 0.75 s / IC for thermosonic bonding（Including process time of 0.2 seconds. Under the fastest conditions) [*1] Placement Accuracy * - XY（3σ at PFSC conditions）： ±7 μm（Flip bonding）, ±15 μm（With pre-centering）, ±25 μm（Direct bonding) {*1] Substrate Dimensions (mm) - L 50 × W 30 to L 280 × W 140（For thermosonic : L 200 × W 150 ) Die Dimensions (mm) - L 0.25 × W 0.25 to L 6 × W 6 Number of Die Types - Up to 12 types（For AWC）/ UP to 10 types（Tray with the palette changer）/ Up to 5 types（Wafer frame with the palette changer)