NX-Wafer is the only wafer fab AFM with automatic defect review. It provides a fully automated AFM solution for defect imaging and analysis that improves defect review productivity by up to 1,000%
Unique features:
Low noise Atomic Force Profiler for accurate, high throughput CMP profile measurements
Sub-Angstrom surface roughness measured with extreme accuracy and minimized tip-to-tip variation
Smart ADR Software
With Park's Smart ADR NX-Wafer provides fully automated defect review and identification, enabling a critical inline process to classify defect types and source their origin through high resolution 3D imaging.
Designed specifically for the semiconductor industry, Smart ADR is the most advanced defect review solution available, featuring automatic target positioning without the need for labor intensive reference marks that often damage the sample. The Smart ADR process improves productivity by up to 1,000% compared to traditional defect review methods. Additionally, the new ADR capability offers up to 20x longer tip life thanks to Park's groundbreaking True Non-Contact™ Mode AFM technology.
Read more: https://www.parksystems.com/index.php/products/industrial-afm/park-wafer/overview