Parker Chomerics CHO-SHIELD® 571 is a highly conductive, advanced coating developed for high volume, precise spray application on circuit boards and semiconductor packages. Combined with innovative technologies and packaging designs, CHO-SHIELD® 571 can provide board level or package level EMI shielding of electrical components.
Applied correctly, CHO-SHIELD® 571 can replace stamped metal cans, saving valuable board space and reducing the overall cost of board level EMI shielding. The polymer system has been custom formulated to closely match the coefficient of thermal expansion (CTE) of typical epoxy molding compounds resulting in great adhesion and environmental stability of the coating on semiconductor devices.
Features/Benefits:
• Designed for high volume spray application
• Silver flake filler
• Good adhesion to semiconductor packaging materials due to CTE (coefficient of thermal expansion) match of polymer
• Environmentally stable
• Withstands wave solder temperatures in excess of 262°C (500°F)