Epoxy adhesive CHO-BOND® 584-208

for metaltwo-componentelectrically-conductive

Parker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required. CHO-BOND® 584-208 is a silver-colored epoxy with a 60 minute working life meant to allow for additional application flexibility. Features and Benefits: • Silver filler is a premium conductivity solution to electrical bonding • Excellent conductivity levels (0.002 ohm-com) • Strong adhesion properties (>1000 PSI lap shear strength) • Medium paste makes it effective for overhead and vertical surface applications • Can be easily dispensed from a small needle for small cracks and voids • Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options • No volatile organic compounds • 1:1 mix ratio makes measurement and application very easy Typical Applications: • Electrical component grounding • Cold soldering