Epoxy adhesive CHO-BOND® 580-208

for metaltwo-componentconductive

Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating. CHO-BOND® 580-208 is a silver-colored epoxy meant to be thinned and applied as a uniform coating with good bonding strength to a variety of substrates Features and Benefits: • Silver filler is a premium conductivity solution to electrical bonding • Excellent conductivity levels (0.003 ohm-com) • Strong adhesion properties (>700 PSI lap shear strength) • Material can be sprayed or screen printed for bus bars • Medium paste makes it effective for easy dispensing from a small needle for small cracks and voids • Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options • No volatile organic compounds • 1:1 mix ratio makes measurement and application very easy Typical Applications: • Bus bars • Grounding of EMI shielding windows