Epoxy adhesive CHO-BOND® 360-20

for metaltwo-componentelectrically-conductive

Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds. CHO-BOND® 360-20 is a light grey-colored epoxy adhesive that provides a cost-effective and electrically conductive joint material for large bond line filling. Features and Benefits: • Silver-plated copper filler is a low cost solution to electrical conductivity options • Good conductivity levels (0.005 ohm-com) • Strong adhesion properties (>1600 PSI lap shear strength) • Thick paste makes it effective for overhead and vertical surface applications • No volatile organic compounds • 1:1 mix ratio makes measurement and application very easy Typical Applications: • Gap filling in electrical boxes • Electrical enclosures • Poorly toleranced castings • EMI vents and windows • Vertical and overhead fillet applications