Parker Chomerics CHO BOND® 2165 is a two-component, stabilized-copper filled sealant specifically formulated for Aerospace and Military applications. CHO BOND® 2165 is a brownish-red colored polyurethane that is often used in conjunction with CHO-SHIELD® 2000 series EMI coatings to serve as a repair kit for military aircraft.
Features and Benefits:
• Excellent electrical conductivity (0.010 ohm-cm)
• Very good corrosion resistance on aluminum substrates
• Aircraft fluid resistance
• Chromate free making it environmentally friendly
• Thick paste can be used on overhead or vertical surfaces
• Elevated temperature cure option (15 minutes at 113°C) as well as room temperature cure option
Typical Applications:
• Aircraft fastener fill
• Gap Filler
• Aircraft repair compound