EMI shielding 81-03-182 series

board levelRFcan

Parker Chomerics RF Shields and Cans and stamped metal components are the optimal solution for reducing or limiting the effect of electromagnetic interference (EMI) on printed circuit boards. Parker Chomerics RF Shields and Cans and stamped metal components are the optimal solution for reducing or limiting the effect of electromagnetic interference (EMI) on printed circuit boards. Developed based on decades of expertise in EMI and RF shielding, precision metal forming, and state-of-the-art manufacturing practices, Parker Chomerics BLS and stamped metal components are designed and manufactured to help provide isolation of board level components, minimize crosstalk, and reduce EMI susceptibility, all without impacting system speed. As each application is unique, Parker Chomerics RF Shields and Cans and components are designed, prototyped, and manufactured based on exact application-specific requirements. Parker Chomerics is a leading producer of innovative technologies and services, providing global solutions for: • Application and design engineering support • Integration with other materials and technologies • Fast and economical prototyping Board Level Shielding (BLS) Components • Full-device EMI and thermal interface material support • EMI/RF emissions testing Features and Benefits: • Highly customizable • Economical • High volume production • Design flexibility • Excellent high frequency EMI/RF shielding • High speed assembly integration Typical Applications: • Connectivity and Wi-Fi equipment • Smart home and smart devices • Laptops, tablets, and smart phones • Streaming media players • Telecommunications and 5G infrastructure