Double-sided printed circuit board BGA

There are many sub-categories of PCB assembly, such as layered layers: single-sided, double-sided, and multi-layer circuit boards; material properties: FPC, PCB, FPCB; Pcb. Thus, when you choose a pcb assembly manufacturer for your project, you need to have a deep understanding of the characteristics of the project to know which points need special attention to pick the most suitable pcb assembly manufacturer. BGA assembly professional factory, PCBasic provides you with Turnkey BGA Assembly Services. What are the characteristics of BGA? On the back of the BGA printed substrate, spherical bumps are made in an array manner to replace pins. The spherical bumps are solder balls, which serve as the connection interface between the packaged IC and the PCB. BGA is a high-performance, small size, lightweight IC package. Compared with other packaging technologies, BGA can accommodate more pins. What are the advantages of BGA? Compared with the previous packaging technology, the thickness and weight are reduced; the parasitic parameters are reduced, the signal transmission delay is small, and the frequency of use is improved; the assembly can be coplanar welding, with high reliability, excellent heat dissipation capacity, electrical characteristics, and high-efficiency system. Product compatibility.