Ceramic PCB substrate refers to a special process board with copper foil directly bonded to the surface (single or double sides) of alumina (Al2O3) or aluminum nitride (AlN) ceramic PCB substrate at high temperature. The manufactured ultra-thin composite substrate has excellent electrical insulation, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns, so it has great current carrying capacity. Therefore, ceramic PCB substrate has become the basic material of high-power power electronic circuit structure technology and interconnection technology.
The advent of ceramic PCB substrate products has started the new development of heat dissipation application industry. Because of the heat dissipation characteristics of ceramic PCB substrate, and the advantages of ceramic PCB substrate such as high heat dissipation, low thermal resistance, long life and voltage resistance, with the improvement of production technology and equipment, the product price has been accelerated and rationalized, thus expanding the application fields of LED industry, such as indicator lights of household appliances, car lights, street lamps and outdoor large billboards. The successful development of ceramic PCB substrate provides better service for indoor lighting and outdoor lighting products, and makes the LED industry have a broader market in the future.
◆ Strong mechanical stress and stable shape; High strength, high thermal conductivity and high insulation; Strong binding force and corrosion resistance.
◆ Good thermal cycle performance with 50,000 cycles and high reliability.