Multilayer printed circuit board
for communication module16 layers

Multilayer printed circuit board - PCBWay - for communication module / 16 layers
Multilayer printed circuit board - PCBWay - for communication module / 16 layers
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Characteristics

Options
multilayer
Applications
for communication module
Number of layers
16 layers

Description

The "7th generation HDI (High Density Interconnect) PCB circuit board with arbitrary interconnections" is one of the series of 7th generation HDI PCB circuit boards developed and manufactured by PCBWay. This particular 7th generation HDI circuit board is fabricated using Shengyi S1000-2M material and undergoes multiple processes such as laser drilling and lamination. The 7th generation HDI board finds extensive applications in high-end smartphones and other similar industries. Material S1000-2M Thickness 1.8±0.13mm Min Hole Size Laser hole 0.1mm Min Track/Spacingh 75/75um Minimum board thickness and hole ratio / Surface Finish Immersion gold(ENIG) 2u"

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